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AN-79 - Wave Soldering Guidelines for InSOP and HSOP Packages

This document offers guidelines for wave soldering design of InSOP-24 and HSOP-28 packages, particularly those without bottom exposed pads. Although IR/convection reflow is recommended for surface-mount attachment, both packages have been designed with wave soldering in mind when it is unavailable or not preferred. The document provides recommendations for solder pad layout, maximum spacing between solder pads, and solder thieves' orientation and design.